Team Group ELITE TED416G3200C22-S01 memory module 16 GB 1 x 16 GB DDR4 260-pin SO-DIMM
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In stock
SKU
TED416G3200C22-S01
Elite DDR4 Laptop Memory
- All new generation product of DRAM module
- 1.2V memory module
- Massive 32GB Kit
| Internal memory type | DDR4 |
|---|---|
| Memory clock speed | 3200 MHz |
| Memory form factor | 260-pin SO-DIMM |
| Component for | Notebook |
| SKU | TED416G3200C22-S01 |
| EAN | 0765441651715 |
| Manufacturer | Team Group |
| Availability | In Stock |
| Product Family | Elite |
Perfect choice for laptop users
TEAMGROUP's ELITE series has released an all-new DDR4 SO-DIMM product which is compliant with JEDEC international standard. With only 1.2V of working voltage, it can save electricity use by 20% compared to its last generation. Therefore, the heat generated from the product itself can also be reduced and maintain the surrounding temperature of the system. It is 100% compatible with INTEL's latest X99 & Skylake chipset. With selected high-quality IC chips and strict testing standard, it is the perfect choice for laptop users, who seek for excellent quality, optimal performance, stability and compatibility.
TEAMGROUP's ELITE series has released an all-new DDR4 SO-DIMM product which is compliant with JEDEC international standard. With only 1.2V of working voltage, it can save electricity use by 20% compared to its last generation. Therefore, the heat generated from the product itself can also be reduced and maintain the surrounding temperature of the system. It is 100% compatible with INTEL's latest X99 & Skylake chipset. With selected high-quality IC chips and strict testing standard, it is the perfect choice for laptop users, who seek for excellent quality, optimal performance, stability and compatibility.
| Power | |
|---|---|
| Memory voltage | 1.2 V |
| Design | |
| Compatible products | 100% compatible with INTEL’s latest X99 & Skylake chipset |
| JEDEC standard | Yes |
| Memory | |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 19 |
| Memory voltage | 1.2 V |
| ECC | No |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Memory bandwidth (max) | 21.3 GB/s |
| Features | |
|---|---|
| Compatible products | 100% compatible with INTEL’s latest X99 & Skylake chipset |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 19 |
| Memory voltage | 1.2 V |
| ECC | No |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Memory bandwidth (max) | 21.3 GB/s |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Logistics data | |
| Harmonized System (HS) code | 84733020 |
| Other features | |
| Harmonized System (HS) code | 84733020 |
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|---|---|---|---|---|---|---|
| SKU |
TED416G3200C22-S01
|
OM16G42133R2RX4E12
|
F4-2400C16D-16GRS
|
OM16G42133SO2RX8NE12
|
OM16G42133U2RX8NE12
|
OM16G42400R2RX4E12
|
| Manufacturer |
Team Group
|
Origin Storage
|
G.Skill
|
Origin Storage
|
Origin Storage
|
Origin Storage
|
| ECC |
N
|
Y
|
N
|
N
|
N
|
Y
|
| Memory form factor |
260-pin SO-DIMM
|
288-pin DIMM
|
260-pin SO-DIMM
|
260-pin SO-DIMM
|
288-pin DIMM
|
288-pin DIMM
|
| Memory layout (modules x size) |
1 x 16 GB
|
1 x 16 GB
|
2 x 8 GB
|
1 x 16 GB
|
1 x 16 GB
|
1 x 16 GB
|
| Internal memory type |
DDR4
|
DDR4
|
DDR4
|
DDR4
|
DDR4
|
DDR4
|
| Component for |
Notebook
|
PC/server
|
Notebook
|
Notebook
|
PC/server
|
PC/server
|
| Internal memory |
16GB
|
16GB
|
N/A
|
N/A
|
16GB
|
16GB
|